中大機構典藏-NCU Institutional Repository-提供博碩士論文、考古題、期刊論文、研究計畫等下載:Item 987654321/29872
English  |  正體中文  |  简体中文  |  Items with full text/Total items : 66984/66984 (100%)
Visitors : 23049812      Online Users : 362
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version


    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/29872


    Title: In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing
    Authors: Lin,YH;Hu,YC;Tsai,CM;Kao,CR;Tu,KN
    Contributors: 材料科學與工程研究所
    Keywords: UNDER-BUMP-METALLIZATION;ELECTROMIGRATION-INDUCED FAILURE
    Date: 2005
    Issue Date: 2010-07-06 15:59:48 (UTC+8)
    Publisher: 中央大學
    Abstract: The electromigration of PbSn eutectic flip-chip solder joints was studied at 30 degrees C with a nominal current density of 4 x 10(4) A/cm(2). The void formation-and-propagation failure mechanism was observed in situ. In the joint with electrons flowing f
    Relation: ACTA MATERIALIA
    Appears in Collections:[Institute of Materials Science and Engineering] journal & Dissertation

    Files in This Item:

    File Description SizeFormat
    index.html0KbHTML512View/Open


    All items in NCUIR are protected by copyright, with all rights reserved.

    社群 sharing

    ::: Copyright National Central University. | 國立中央大學圖書館版權所有 | 收藏本站 | 設為首頁 | 最佳瀏覽畫面: 1024*768 | 建站日期:8-24-2009 :::
    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - Feedback  - 隱私權政策聲明