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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/29874


    Title: Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations
    Authors: Luo,WC;Ho,CE;Tsai,JY;Lin,YL;Kao,CR
    Contributors: 材料科學與工程研究所
    Keywords: AU/NI SURFACE FINISH;LEAD-FREE SOLDERS;MICROELECTRONIC PACKAGES;INTERFACIAL REACTIONS;ELECTRONIC PACKAGES;COPPER-TIN;JOINTS;METALLIZATION;TECHNOLOGY;SUBSTRATE
    Date: 2005
    Issue Date: 2010-07-06 15:59:50 (UTC+8)
    Publisher: 中央大學
    Abstract: It had been reported that, during the reflow of the Sn-Ag-Cu solders over the Ni-bearing surface finishes, a slight variation in Cu concentration produced different reaction products at the interface. In this study, we extended our earlier efforts to inve
    Relation: MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
    Appears in Collections:[材料科學與工程研究所 ] 期刊論文

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