Pronounced electromigration of Cu in molten Sn-based solders

NCUIR > Engineering College > National Central University Department of Chemical & Materials Engineering > journal & Dissertation > Item 987654321/30274

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30274

Title:	Pronounced electromigration of Cu in molten Sn-based solders
Authors:	Huang,J. R.;Tsai,C. M.;Lin,Y. W.;Kao,C. R.
Contributors:	化學工程與材料工程研究所
Keywords:	INTERMETALLIC COMPOUND;INTERFACIAL REACTIONS;INDUCED FAILURE;JOINTS;INTERCONNECTS;PROPAGATION;DISSOLUTION;COPPER
Date:	2008
Issue Date:	2010-07-06 16:15:51 (UTC+8)
Publisher:	中央大學
Abstract:	The high local temperature in flip-chip solder joints of microprocessors has raised concerns that the solder, a low melting temperature alloy, might locally liquefy and consequently cause failure of the microprocessors. This article reports a highly inter
Relation:	JOURNAL OF MATERIALS RESEARCH????
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

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