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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30387

    Title: Effect of Cu additives on Sn whisker formation of Sn(Cu) finishes
    Authors: Kao,HJ;Wu,WC;Tsai,ST;Liu,CY
    Contributors: 化學工程與材料工程研究所
    Keywords: GROWTH
    Date: 2006
    Issue Date: 2010-07-06 16:18:16 (UTC+8)
    Publisher: 中央大學
    Abstract: Sn whisker formation on Sn(Cu) finishes has been studied. (1) With respect to the thickness effect, we found that Sn whisker density for pure Sn and Sn0.7Cu finishes has a linear relationship with the finish thickness. The safety thickness for Sn and Sn0.
    Appears in Collections:[化學工程與材料工程研究所] 期刊論文

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