Kinetic analysis of the interfacial reactions in Ni/Sn/Cu sandwich structures

NCUIR > Engineering College > National Central University Department of Chemical & Materials Engineering > journal & Dissertation > Item 987654321/30424

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30424

Title:	Kinetic analysis of the interfacial reactions in Ni/Sn/Cu sandwich structures
Authors:	Wang,S. J.;Liu,C. Y.
Contributors:	化學工程與材料工程研究所
Keywords:	SOLDER JOINTS;CU-SN;TECHNOLOGY;DIFFUSION;SYSTEM;NI
Date:	2006
Issue Date:	2010-07-06 16:19:06 (UTC+8)
Publisher:	中央大學
Abstract:	The mutual interaction between Sn/Ni and Sn/Cu interfacial reactions in a Ni/Sn/Cu sandwich sample has been studied. The major interfacial reaction product on the Cu side was Cu6Sn5, while on the Ni side, a ternary (Cu,Ni)(6)Sn-5 compound layer was formed
Relation:	JOURNAL OF ELECTRONIC MATERIALS
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

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