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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30612


    Title: Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction
    Authors: Wu,AT;Tu,KN;Lloyd,JR;Tamura,N;Valek,BC;Kao,CR
    Contributors: 化學工程與材料工程研究所
    Keywords: IN-SITU;ALUMINUM;LINES;INTERCONNECTS;CONDUCTORS
    Date: 2004
    Issue Date: 2010-07-06 16:23:22 (UTC+8)
    Publisher: 中央大學
    Abstract: Under constant current electromigration, white tin exhibited a resistance drop of up to 10%. It has a body-centered-tetragonal structure, and the resistivity along the a and b axes is 35% smaller than along the c axis. Microstructure evolution under elect
    Relation: APPLIED PHYSICS LETTERS
    Appears in Collections:[化學工程與材料工程研究所] 期刊論文

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