A study on the reaction between cu and Sn3.5Ag solder doped with small amounts of Ni

NCUIR > Engineering College > National Central University Department of Chemical & Materials Engineering > journal & Dissertation > Item 987654321/30673

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30673

Title:	A study on the reaction between cu and Sn3.5Ag solder doped with small amounts of Ni
Authors:	Tsai,JY;Hu,YC;Tsai,CM;Kao,CR
Contributors:	化學工程與材料工程研究所
Keywords:	SN-AG;INTERFACIAL REACTIONS;GROWTH;MICROSTRUCTURE;SUBSTRATE
Date:	2003
Issue Date:	2010-07-06 16:24:46 (UTC+8)
Publisher:	中央大學
Abstract:	The reaction between Cu and the Sn-Ag solders doped with different amounts of Ni is studied. Four different solders with the Ag concentration fixed at 3.5 wt.% and Ni concentrations varied between 0.0 wt.% and 1.0 wt.% are used. In contrast to the reactio
Relation:	JOURNAL OF ELECTRONIC MATERIALS
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

Files in This Item:

File	Description	Size	Format
index.html		0Kb	HTML	411	View/Open

社群 sharing