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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30706


    Title: Electromigration failure in flip chip solder joints due to rapid dissolution of copper
    Authors: Hu,YC;Lin,YH;Kao,CR;Tu,KN
    Contributors: 化學工程與材料工程研究所
    Keywords: LEAD-TIN ALLOYS;DIFFUSION;SILVER
    Date: 2003
    Issue Date: 2010-07-06 16:25:28 (UTC+8)
    Publisher: 中央大學
    Abstract: An electromigration failure mechanism in flip chip solder joints is reported in this communication. The solder joints failed by a very rapid, asymmetrical, and localized dissolution of the Cu metallization on the cathode side. The average dissolution rate
    Relation: JOURNAL OF MATERIALS RESEARCH
    Appears in Collections:[化學工程與材料工程研究所] 期刊論文

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