Inhibiting the formation of (Au1-xNix)Sn-4 and reducing the consumption of Ni metallization in solder joints

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Title:	Inhibiting the formation of (Au1-xNix)Sn-4 and reducing the consumption of Ni metallization in solder joints
Authors:	Ho,CE;Shiau,LC;Kao,CR
Contributors:	化學工程與材料工程研究所
Keywords:	PACKAGES;NICKEL;GROWTH
Date:	2002
Issue Date:	2010-07-06 16:28:13 (UTC+8)
Publisher:	中央大學
Abstract:	The effects of adding a small amount of Cu into eutectic PbSn solder on the interfacial reaction between the solder and the Au/Ni/Cu metallization were studied. Solder balls of two different compositions, 37Pb-63Sn (wt.%) and 36.8Pb-62.7Sn-0.5Cu, were use
Relation:	JOURNAL OF ELECTRONIC MATERIALS
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

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