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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30825


    Title: Inhibiting the formation of (Au1-xNix)Sn-4 and reducing the consumption of Ni metallization in solder joints
    Authors: Ho,CE;Shiau,LC;Kao,CR
    Contributors: 化學工程與材料工程研究所
    Keywords: PACKAGES;NICKEL;GROWTH
    Date: 2002
    Issue Date: 2010-07-06 16:28:13 (UTC+8)
    Publisher: 中央大學
    Abstract: The effects of adding a small amount of Cu into eutectic PbSn solder on the interfacial reaction between the solder and the Au/Ni/Cu metallization were studied. Solder balls of two different compositions, 37Pb-63Sn (wt.%) and 36.8Pb-62.7Sn-0.5Cu, were use
    Relation: JOURNAL OF ELECTRONIC MATERIALS
    Appears in Collections:[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

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