Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages

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題名:	Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages
作者:	Shiau,LC;Ho,CE;Kao,CR
貢獻者:	化學工程與材料工程研究所
關鍵詞:	AU FOILS;METALLIZATION;JOINTS;GROWTH
日期:	2002
上傳時間:	2010-07-06 16:28:54 (UTC+8)
出版者:	中央大學
摘要:	The reactions between Sn-Ags-Cu lead-free solders of various compositions and Au/Ni surface finish in advanced electronic packages were studied. Three solder compositions, Sn-3.5Ag, Sn4Ag-0.5Cu, and Sn-3.5Ag-0.75Cu were used, and their performance was com
關聯:	SOLDERING & SURFACE MOUNT TECHNOLOGY
顯示於類別:	[化學工程與材料工程研究所] 期刊論文

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