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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30856


    Title: Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages
    Authors: Shiau,LC;Ho,CE;Kao,CR
    Contributors: 化學工程與材料工程研究所
    Keywords: AU FOILS;METALLIZATION;JOINTS;GROWTH
    Date: 2002
    Issue Date: 2010-07-06 16:28:54 (UTC+8)
    Publisher: 中央大學
    Abstract: The reactions between Sn-Ags-Cu lead-free solders of various compositions and Au/Ni surface finish in advanced electronic packages were studied. Three solder compositions, Sn-3.5Ag, Sn4Ag-0.5Cu, and Sn-3.5Ag-0.75Cu were used, and their performance was com
    Relation: SOLDERING & SURFACE MOUNT TECHNOLOGY
    Appears in Collections:[化學工程與材料工程研究所] 期刊論文

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