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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30916


    Title: Interactions between solder and metallization during long-term aging of advanced microelectronic packages
    Authors: Ho,CE;Chen,WT;Kao,CR
    Contributors: 化學工程與材料工程研究所
    Keywords: JOINTS;GROWTH
    Date: 2001
    Issue Date: 2010-07-06 16:30:23 (UTC+8)
    Publisher: 中央大學
    Abstract: The reactions between the eutectic PbSn solder and the Au/Ni/Cu tri-layer metallization in advanced microelectronic packages were studied. In this investigation, reflowed packages were subjected to aging at 160 degreesC for times as long as 4000 h. Immedi
    Relation: JOURNAL OF ELECTRONIC MATERIALS
    Appears in Collections:[化學工程與材料工程研究所] 期刊論文

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