Electroplating of copper onto a preanodized 7005Al/Al2O3(P) metal matrix composite

NCUIR > Engineering College > Graduate Institute of Mechanical Engineering > journal & Dissertation > Item 987654321/30919

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30919

Title:	Electroplating of copper onto a preanodized 7005Al/Al2O3(P) metal matrix composite
Authors:	Lin,JC;Jehng,WD;Lee,SL
Contributors:	機械工程研究所
Keywords:	OXYGEN BEARING WATERS;POROUS ANODIC FILMS;MILD-STEEL;ALUMINUM;CORROSION;BEHAVIOR;H3PO4
Date:	2003
Issue Date:	2010-07-06 16:30:27 (UTC+8)
Publisher:	中央大學
Abstract:	The electroplating of copper onto 7005Al/Al2O3(P) metal matrix composites (Al MMC) is difficult but becomes feasible if the composites have been preanodized in mineral acids. It is clear that phosphoric (P) acid anodizing is better than oxalic (O) or sulf
Relation:	JOURNAL OF APPLIED ELECTROCHEMISTRY
Appears in Collections:	[Graduate Institute of Mechanical Engineering] journal & Dissertation

Files in This Item:

File	Description	Size	Format
index.html		0Kb	HTML	387	View/Open

社群 sharing