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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30946


    Title: Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering
    Authors: Ho,CE;Tsai,SY;Kao,CR
    Contributors: 化學工程與材料工程研究所
    Keywords: GRID-ARRAY PACKAGES;INTERMETALLIC COMPOUND;GROWTH;JOINTS;AU/NI;FINISH;GOLD;NI
    Date: 2001
    Issue Date: 2010-07-06 16:31:15 (UTC+8)
    Publisher: 中央大學
    Abstract: Gold over Ni is one of the most common surface finishes for Cu soldering pads in ball-grid-array (BGA) and other electronic packages. The Au layer is for oxidation protection, and the Ni layer serves as a solderable diffusion barrier. In this study, eutec
    Relation: IEEE TRANSACTIONS ON ADVANCED PACKAGING
    Appears in Collections:[化學工程與材料工程研究所] 期刊論文

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