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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/31006


    Title: Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrate
    Authors: Chen,C;Ho,CE;Lin,AH;Luo,GL;Kao,CR
    Contributors: 化學工程與材料工程研究所
    Keywords: INTERMETALLIC COMPOUNDS;INTERFACIAL REACTIONS;SN;BI;DIFFUSION;SYSTEMS;GROWTH;CU
    Date: 2000
    Issue Date: 2010-07-06 16:32:46 (UTC+8)
    Publisher: 中央大學
    Abstract: The reaction between Ni and eutectic BiSn solder at 85 degrees C, 100 degrees C, 120 degrees C, and 135 degrees C was studied. Reaction times ranging from 25 h to 3600 h were used. Only Ni3Sn4 was detected as a result of the reaction. None of the other Ni
    Relation: JOURNAL OF ELECTRONIC MATERIALS
    Appears in Collections:[化學工程與材料工程研究所] 期刊論文

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