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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/31021


    Title: Optimizing the wire-bonding parameters for second bonds in ball grid array packages
    Authors: Ho,CE;Chen,C;Kao,CR
    Contributors: 化學工程與材料工程研究所
    Date: 2000
    Issue Date: 2010-07-06 16:33:08 (UTC+8)
    Publisher: 中央大學
    Abstract: The bonding parameters for the second bonds in EGA were optimized using the Taguchi L27 experimental design. The bond wire was a 33 mu m gold wire, and the bond pads had Au/Ni/Cu three-layer structures. The objective function for the optimization was the
    Relation: JOURNAL OF THE CHINESE INSTITUTE OF ENGINEERS
    Appears in Collections:[化學工程與材料工程研究所] 期刊論文

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