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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/31051


    Title: Finite element analysis of anisotropic conductive film for chip on glass process
    Authors: Cheng,YN;Lee,S;Lee,J
    Contributors: 機械工程研究所
    Date: 2002
    Issue Date: 2010-07-06 16:33:53 (UTC+8)
    Publisher: 中央大學
    Abstract: Anisotropically conductive film (ACF) is a smart electronic packaging material that consumes minimal space for connecting integrated circuit (IC) chips to a liquid crystal display (LCD) panel or printed circuit board. It consists of an adhesive resin and
    Relation: MATERIALS AND MANUFACTURING PROCESSES
    Appears in Collections:[機械工程研究所] 期刊論文

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