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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/31076

    Title: Solid-liquid interdiffusion bonding between In-coated silver thick films
    Authors: Lin,JC;Huang,LW;Jang,GY;Lee,SL
    Contributors: 機械工程研究所
    Keywords: COUPLES;POWDER
    Date: 2002
    Issue Date: 2010-07-06 16:34:50 (UTC+8)
    Publisher: 中央大學
    Abstract: Solid-liquid interdiffusion (SLID) bonding between two pieces of In-coated silver thick films was investigated. The silver thick film was prepared by screen-printing of silver paste on an aluminum oxide substrate. Indium was coated in thickness ranging fr
    Relation: THIN SOLID FILMS
    Appears in Collections:[機械工程研究所] 期刊論文

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