A general optimization for slurry injection during chemical mechanical polishing

NCUIR > Engineering College > Graduate Institute of Mechanical Engineering > journal & Dissertation > Item 987654321/31142

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/31142

Title:	A general optimization for slurry injection during chemical mechanical polishing
Authors:	Chou,FC;Fu,MN;Wang,MW
Contributors:	機械工程研究所
Date:	2000
Issue Date:	2010-07-06 16:37:16 (UTC+8)
Publisher:	中央大學
Abstract:	A general optimization for slurry injection position and injection rate during chemical mechanical polishing, which is valid for the Rodel SUBA 400 pad with 150, 200, and 300 mm wafers and the Rodel POLITEX DG pad with 200 mm wafer, is presented. The exis
Relation:	JOURNAL OF THE ELECTROCHEMICAL SOCIETY
Appears in Collections:	[Graduate Institute of Mechanical Engineering] journal & Dissertation

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