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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/32733


    Title: Thermal stability improvement by using Pd/NiO/Al/Ti/Au reflective ohmic contacts to p-GaN for flip-chip ultraviolet light-emitting diodes
    Authors: Pan,CC;Chen,GT;Hsu,WJ;Lin,CW;Chyi,JI
    Contributors: 電機工程研究所
    Keywords: LOW-RESISTANCE;METALLIZATION
    Date: 2006
    Issue Date: 2010-07-07 09:56:39 (UTC+8)
    Publisher: 中央大學
    Abstract: The thermal stability, optical reflectivity, and contact resistivity of Pd/NiO/Al/Ti/Au ohmic contacts to p-type GaN were investigated. In contrast to Pd/Ni/Al/Ti/Au counterparts, the ohmic contacts Pd/NiO/Al/Ti/Au retained their specific contact resistiv
    Relation: APPLIED PHYSICS LETTERS
    Appears in Collections:[電機工程研究所] 期刊論文

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