水蒸氣電漿火炬設備處理半導體蝕刻製程廢氣效率之初步研究; Steam Plasam Torch Equipment in Treating the Waste Gases of Semiconductor Etching Processes

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题名:	水蒸氣電漿火炬設備處理半導體蝕刻製程廢氣效率之初步研究;Steam Plasam Torch Equipment in Treating the Waste Gases of Semiconductor Etching Processes
作者:	曾能芳;NENG-FANG TSENG
贡献者:	環境工程研究所碩士在職專班
关键词:	水蒸氣電漿火炬;電漿;溫室氣體;全氟化合物(PFCs);Steam Plasma Torch;Plasma;Green house gases;Perfluocarbons (PFCs)
日期:	2006-07-09
上传时间:	2009-09-21 12:14:08 (UTC+8)
出版者:	國立中央大學圖書館
摘要:	溫室效應氣體造成地球溫暖化是近年來全球重大的議題，在保護地球的要求下，對於這些氣體如果處理不當，除了影響地球環境也會影響到國家的經濟。我國半導體和薄膜液晶顯示器（TFT-LCD）產量佔全球三成以上，如果所使用的全氟化物未進行減量的話，產品外銷將可能會遭受到抵制。本文以水蒸氣電漿火炬設置於半導體蝕刻製程配合濕式洗滌塔進行廢氣處理，從前導實驗顯示如果處理CF4效率要達到90％以上，水蒸氣電漿火炬操作功率率至少要有17 kW以上，因此本文以17 kW操作功率進行廢氣處理。檢測廢氣成份是以傅利葉轉換紅外光譜分析儀(FTIR)，交互檢測一個反應槽和同時檢測七個反應槽的入口和出口廢氣的C2F6、CF4、SF6、HF、HCl濃度，檢結果顯示這些溫室氣體的處理效率都可達90%以上。但同時處理7個Chambers廢氣超過本系統的負載，以致於會有SO2、C2F6、CF4、SF6等氣體在出口檢測到突發濃度。本文也針對廢氣處理後的氫化物（HCN）副產物分析，確認僅有微量的HCN產生。從本文展現的處理效率，顯示水蒸氣電漿火炬搭配濕式洗滌塔，可以有效處理半導體蝕刻製程排放的溫室效應氣體。 The effect of green house gases on global warming draws a great attention globally. Under the protectionism stream for the earth, improper treatment of these gases will affect not only the earth environment but also a nation’s economy. The products of semiconductor manufacturing and TFT-LCD from Taiwan share more than 30% in the world. If the quantity of Perfluocarbons (PFCs) used in the manufacturing process is not reduced, an inhibition of the electronic products imported from Taiwan may happen. The destruction efficiency data of waste gases from semiconductor etching processes by using steam plasma torch coupled with a wet scrubber are compiled in this study. The operating power of steam plasma torch should be above 17 kW to treat CF4 for reaching more than 90% efficiency as found in a pre-study. Therefore, the operating power of steam plasma torch is set at 17 kW in this study. Fourier Transform Infrared Spectroscopy is adopted in this study to measure C2F6, CF4, SF6, HF, and HCl concentrations in the inlet and outlet of treatment process alternately. The results show that the destruction efficiency can reach as high as 90% for PFCs from both one and seven chambers. However, simultaneously treating the waste gases from seven chambers exceeds the capacity of this system such that SO2, C2F6, CF4, and SF6 spikes are observed in the outlet. Hydrogen Cyanide is the by-product normally found in the manufacturing process which is confirmed from outlet detection by only a minor amount in this study. The destruction efficiency from steam plasma torch coupled with a wet scrubber as shown in this study proved to be an effective way in treating green house gases emitted from semiconductor etching processes.
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