資源是促進科技發展與經濟繁榮的主要動力，但大多數資源被開發利用後，常具有耗竭性而無法再生利用，而隨著人類文明腳步及工業科技開發的快速發展，資源有加速耗竭的趨勢，開發中及已開發之國家的情況愈是嚴重。就資源永續利用的觀點而言，金屬資源隸屬耗竭性資源，無法由自然界重新再生，因此避免金屬資源的持續耗竭，實有回收再利用的必要性與迫切性。 在印刷電路板工業中，蝕刻液是屬於高用量與高污染性質的廢液，本研究透過酸鹼中和法，將氫氧化鈉溶液添加於印刷電路板廠所產生之高濃度酸性氯化銅蝕刻廢液以製備各種不同的銅鹽，藉由蝕刻廢液回收有用的資源，以有效減少資源耗竭、環境污染，達到廢棄物資源化再利用之永續經營。本研究主要探討蝕刻廢液回收處理廠以化學沉澱法操作之最適化各項操作參數，以利有效回收電子業之含銅廢液中之銅金屬。 實驗結果顯示：(1)蝕刻廢液pH值介於5?8時，反應會生成綠色氧氯化銅沉澱；pH值達9時，反應則生成藍色氫氧化銅沉澱；pH值達12以上，反應轉而生成黑色氧化銅沉澱；(2)以XRD、SEM、AAS分析資源化產品氧氯化銅、氫氧化銅、氧化銅的物理性質，資源化產品純度均高達99%以上；(3)氧化銅中殘餘氯的含量隨著煅燒溫度增加而逐漸降低，當煅燒溫度達到800 ℃時，殘餘氯含量已低於100 ppm以下；以及(4)在煅燒溫度低於600 ℃時，其氧化銅表面型態呈絨毛絲狀；當煅燒溫度高於600 ℃時，該絨毛絲狀消失而轉變成顆粒狀。 本研究在鹼式氯化銅之實驗過程中，經化學沉澱法反應製備之回收率偏低。建議未來針對此研究議題時，可增加其他對於鹼式氯化銅之製備方法，以期能獲得更具可代表性之再利用率。由於實驗之氯化銅蝕刻液均取自同一家廠商，且銅含量在155,300 ~ 140,500 ppm。建議對於未來的研究者，可增加不同濃度之氯化銅蝕刻液之來源及廠家，探討不同銅含量下之回收率，以符合業界需求，提升整體競爭優勢。 In recent days due to the fast development of industrial and scientific technologies with the human civilization, the resources have the tendency to exhaust. After the most resources of the earth are developed and utilized, exhausting and non-regeneration do occur and this situation is very serious in both developed and undeveloped countries. Among the view of several resources, metal resources belong to exhausting resources as it is unable to regenerate again. So, to avoid the lasting exhaustion of metal resources, recovery and regeneration of the resource is necessary, which is emphasized in the present work. This work has been devised to treat the highly pollutant etchants of the printed circuit board industry. The idea of this research is to prepare the copper salt from waste etching liquid containing acidic copper chloride by chemical precipitation method. In an environmental and economic point of view, indeed it is a waster recovery and sustainable development as the retrieval of the valuable natural resource from waster etching solution is an important problem. The results obtained from the experiments show that the formation of copper oxychloride at pH 5 to 8 and the formation of copper hydroxide at pH 9 to 12 occur. All these products are characterized by XRD, SEM and AAS. The sintering temperature plays an important role and the effect of sintering temperature is well discussed. The SEM analysis reveals that below 600?C copper oxide is pile-shaped and above 600°C it became spherical. The chloride content of copper oxide decreases gradually as the sintering temperature increases and when 800?C is reached, the residual chloride concentration is found to be less than 100 ppm only.
