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    請使用永久網址來引用或連結此文件: http://ir.lib.ncu.edu.tw/handle/987654321/3428


    題名: 半導體廠局部尾氣處理設備危害與風險評估;Hazard Analysis and Risk Assessment of Local Scrubber of the Semiconductor Industry
    作者: 洪健仁;Chien-jen Hung
    貢獻者: 環境工程研究所碩士在職專班
    關鍵詞: 局部尾氣處理設備;風險評估;異常狀態管理;Risk assessment;Abnormal situation management;Local scrubber
    日期: 2009-07-04
    上傳時間: 2009-09-21 12:16:00 (UTC+8)
    出版者: 國立中央大學圖書館
    摘要: 半導體業帶動台灣經濟蓬勃發展多年,每年為台灣帶來可觀的高額產值,截至今日,仍然是台灣的龍頭產業、經濟發展的重要指標。因製程的需求,必須大量使用毒性、易燃性氣體,造成製程中衍生大量廢氣,後段的處理設備,必須達到高效能處理,才能讓操作人員能在安全、無慮的環境中作業。然而製程局部尾氣處理設備(local scrubber, LS),大多探討設備本身的處理效率,鮮少針對設備本身危害進行分析與評估,即使有相關的風險評估方法,仍舊不夠詳盡且無法辨識危害的根本原因。本研究目的在於分析局部尾氣處理設備常見的危害,藉由異常事件資料庫獲得的訊息,提出新的風險評估方法,代替HazOp, FTA, ETA, 等常用的評估方式,並利用SEMI S-10評估標準於局部尾氣處理設備的廠區異常事件上,建立適合的風險評估工具和風險控制方法。異常事件資料庫是由半導體12吋晶圓廠2007年3月至2009年4月之間的異常事件資料,由異常事件資料庫鑑別危害的根本原因與類別,以及異常事件報告情境的特徵。這些潛在的異常事件危害因素,影響包含人員安全、環境損害、設備與營運損失。本研究藉由半導體各部門相關經驗工程師組成的小組,推導出頻率與嚴重程度的等級,並建議有效的風險控制措施,期望將本研究結果,提供半導體產業參考應用。 The semiconductor industry has been the major driving force for Taiwan’s economic development over the past twenty years. It remains as the leader of Taiwan’s hi-tech industries. Reactive and combustible gases are commonly used in semiconductor fabrication processes. Because of low reaction rate in most process chambers, majority of the chemicals are discharged as exhaust gas and are treated in local scrubbers. Due to the toxic, corrosive and pyrophoric characteristics of the exhaust gases, safety becomes a major concern of local scrubbers in addition to abatement efficiency. This study proposes a novel approach for risk assessment of local scrubbers. Instead of common risk assessment techniques such as HazOp, FTA, ETA, etc., this study utilizes SEMI S10 risk assessment standard on abnormal situation records of a facility’s local scrubbers. The abnormal situation database of a 12” fab was collected between April, 2007 and March, 2009. The abnormal situation database is thoroughly analyzed to identify the cause, classification, and characteristics of each reported abnormal situation. Weighting factors are assigned to the potential consequences such as human safety, environmental damage, direct cost, and business interruption of each abnormal situation. The frequency and severity based risk levels are derived by a group of engineers representing various departments of the semiconductor company. Risk control recommendations were also derived from the consensus of the group members. It is hoped that this novel yet realistic approach can be used in other semiconductor fabs as well.
    顯示於類別:[環境工程研究所碩士在職專班] 博碩士論文

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