以非熱電漿結合吸附劑處理C3F8之研究; Removal of C3F8 via the Combination of Nonthermal Plasma and Adsoption

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題名:	以非熱電漿結合吸附劑處理C3F8之研究;Removal of C3F8 via the Combination of Nonthermal Plasma and Adsoption
作者:	黃晴澤;Ching-tse Huang
貢獻者:	環境工程研究所
關鍵詞:	非熱電漿;C3F8;吸附劑;介電質放電;停留時間;removal efficiency.;PFCs;plasma;adsorption;adsorbent
日期:	2009-06-09
上傳時間:	2009-09-21 12:19:18 (UTC+8)
出版者:	國立中央大學圖書館
摘要:	C3F8近年來已逐漸取代CF4及C2F6成為高科技產業CVD腔體清洗之主要清洗氣體，其具高化學穩定性及強紅外線吸收能力，乃京都議定書明訂管制之溫室效應氣體之ㄧ。目前全氟化物主流處理技術為燃燒法和觸媒法，兩者之缺點為無污染物排放期間仍須維持相當溫度，耗能較高並有發生工安意外之虞。非熱電漿技術具快速啟動且無須維持高溫等特性，為極具應用前景之新興技術，其技術瓶頸為污染物去除之能量效率和產物選擇性尚有改善空間。如整合吸附劑物理吸附作用延長污染物停留時間、增加污染物濃度與非熱電漿於室溫即可啟動並迅速反應等特性，可同時改善污染物去除之能量效率及產物選擇性。本研究利用吸附劑結合介電質放電(DBD)處理C3F8，藉由吸附劑之物理吸附延長污染物停留時間，探討吸附劑之吸附效能、電漿處理對吸附劑之影響、吸附劑於電漿放電中對去除率及產物選擇性之影響。研究結果顯示，以吸附效果而言，球狀活性碳為最佳，推測原因為吸附劑表面之含氧官能基會對C3F8吸附效能造成影響；吸附劑經放電處理後，造成BET比表面積下降且使平均孔洞尺寸上升，而表面含氧官能基數量則有所增加。於本研究中，C3F8之轉化率隨著氧氣含量增加而提昇，但過量之氧氣將不利於轉化C3F8；在相同比能量密度下，吸附劑置入於電漿系統可改善其去除效率及產物選擇性，推論為吸附劑可延長C3F8之停留時間，可增加電子與C3F8之碰撞機率。本研究證實吸附劑置入有助於非熱電漿技術去除C3F8，深具發展潛力。 Perfluorinated compounds (PFCs) are widely used in semiconductor industry for chemical vapor deposition (CVD) and dry etching. PFCs have strong apacities on infrared rays absorption, they will aggravate global warming once emitted into the atmosphere. Among the diverse strategies for PFCs removal, the abatement techniques is still the most available one. Combustion and catalytic oxidation are commonly used approaches for reducing PFC emissions. However, relatively high fuel cost and potential poisoning of catalyst limit their further application. This study investigates the effectiveness of plasma combined with adsorbent for C3F8 removal. The experimental results indicate Bead-shape activated carbon has the best adsorption capacity, the reason supposed to be the oxygen functional groups at adsorbent surface would affect the adsorption capacity of C3F8. Adsorbent after plasma treatment will decrease BET surface area and increase average pore diameter, and the amount of oxygen functional groups at surface increase as well. The removal efficiency of C3F8 increased with application of oxygen content. However, removal efficiency of C3F8 was found to decrease if more than 2% of oxygen was applied. The removal efficiency and product selectivity of C3F8 achieved with plasma combined with adsorbent were significantly higher than those without adsorbent of might result from the fact that adorbent can extend the retention time of C3F8. Experimental results indicate that plasma combined with adsorbent for C3F8 removal was technically feasible.
顯示於類別:	[環境工程研究所 ] 博碩士論文

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