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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/3701


    Title: 錫銅無鉛銲料與Ni基材界面反應之研究;Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders
    Authors: 陳文泰;Wen-Tai Chen
    Contributors: 化學工程與材料工程研究所
    Keywords: 波銲;;錫銅;無鉛銲料;共晶;wave-soldering;lead-free solder;Sn-0.7Cu
    Date: 2002-06-27
    Issue Date: 2009-09-21 12:20:30 (UTC+8)
    Publisher: 國立中央大學圖書館
    Abstract: 隨著環保聲浪的抬起,目前工業界打算採用無鉛銲料,用來取代63Sn-37Pb含鉛銲料。本論文探討錫銅無鉛銲料與Ni間之反應,此一銲料在波銲製程或是迴銲製程上皆有其應用性。本研究探討液態Sn-Cu銲料中微量銅濃度的變化,與Ni基材之反應情形,此一研究,除上述液態反應研究外,本論文也深入探討固態Sn-Cu銲料與Ni之反應,發現一很有趣的現象,即銲料中Cu濃度的些許變化,大幅度的影響界面生成物之種類及形態。 本研究所選用的Sn-xCu銲料,其x分別為0.2、0.4、0.6、0.7、1及3 (wt.%)。在液態反應實驗中,發現微量銅濃度變化,造成界面上介金屬化合物的種類及形態明顯的不一樣。當銅濃度低時(Sn-0.2Cu),界面上生成一層連續的(Ni1-xCux)3Sn4化合物;當Cu濃度高時(Sn0.6Cu ~ Sn1Cu) ,界面上生成(Cu1-yNiy)6Sn5化合物;而當銅的濃度介於上二者之間 (Sn-0.4Cu) 時,在界面上(Ni1-xCux)3Sn4及(Cu1-yNiy)6Sn5同時存在。 但在固態反應實驗中,Cu濃度變化的影響較不重要,此時溫度及時間的影響較為主要,在不同溫度及不同的反應時間下,界面上之化合物種類也不同。在反應溫度225℃,反應時間由25小時~400小時之間,不管Cu濃度變化如何,界面上之生成物永遠以二層存在,底下接近Ni層的為(Ni1-xCux)3Sn4相,其上頭化合物為(Cu1-yNiy)6Sn5。 在介金屬生長速率的分析上,本研究由液態反應實驗發現介金屬化合物遵循反應控制,而固態反應則遵循擴散控制。 由本研究結果發現,工業界選用Sn-Cu銲料時,對於Cu濃度的控制,必須非常的精確,因為只差0.2 wt.%的Cu濃度,界面上生成物種類及形態明顯不同,嚴重影響界面上化合物之機械性質。故銲料組成中Cu金屬濃度必須控制在0.1 wt.%之內,以確保產品品質。 The eutectic 99.3Sn-0.7Cu solder (wt%, Sn-0.7Cu) is the most promising lead-free replacement for the eutectic Sn-Pb solder in wave-soldering applications. In this study, the effect of a small perturbation in the Cu concentration on the reaction between the Sn-0.7Cu solder and Ni was investigated. Specifically, four Sn-xCu solders (x = 0.2, 0.4, 0.7, and 1) were reacted with Ni at 250 degreesC. A slight variation in Cu concentration produced completely different reaction products. When the Cu concentration was low (x = 0.2), the reaction product was (Ni1-xCux)(3)Sn-4. At high Cu concentrations (x = 0.7 and 1), the reaction product was (Cu1-yNiy)(6)Sn-5. When the Cu concentration was in-between (x = 0.4), both (Nil-xCux)(3)Sn-4 and (Cu1-yNiy)(6)Sn-5, formed. The above findings were rationalized using the Cu-Ni-Sn isotherm. the results of this study imply that the Cu concentration must be strictly controlled in industrial production to produce the desired intermetallic at the interface.
    Appears in Collections:[化學工程與材料工程研究所] 博碩士論文

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