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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/3857

    Title: 覆晶接點與錫電路之電遷移微結構變化模式研究;Electromigration Induced Microstructure change in Flip Chip Solders Joint and Tin Stripe
    Authors: 胡應強;Ying-Chiang Hu
    Contributors: 化學工程與材料工程研究所
    Keywords: 固態擴散;微結構;電遷移;錫電路;銲料;solid state diffusion;Microstructure;Tin stripe;electromigration;solder
    Date: 2004-11-23
    Issue Date: 2009-09-21 12:24:23 (UTC+8)
    Publisher: 國立中央大學圖書館
    Abstract: 摘要 電遷移效應對金屬導線的影響,一直被人們重視,近年來由於半導體與微機電工業之興起,大電流對微細化電路之影響,顯得特別重要,本文針對微細之錫導線與覆晶式共晶錫鉛接點在常溫下(30oC)與高溫下(100oC,70 oC)通入電流密度4 Abstract The electromigration failure mechanism in conducting wire and solder joints through the large current density was studied in detail. When environmental temperature was changed to room temperature, 70 oC and 100oC with a nominal current density of 4
    Appears in Collections:[化學工程與材料工程研究所] 博碩士論文

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