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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/3858


    Title: 電遷移對銅於液態銲錫中的溶解速率之影響;The dissolution rate of copper in the molten solder with current stressing
    Authors: 黃建融;Chien-Zong Huang
    Contributors: 化學工程與材料工程研究所
    Keywords: 電遷移;液態銲錫;溶解速率;;current stressing;dissolution ra;molten solder
    Date: 2005-06-16
    Issue Date: 2009-09-21 12:24:25 (UTC+8)
    Publisher: 國立中央大學圖書館
    Abstract: 在以往銲錫的電遷移研究中,探討對象都是固態銲錫,而液態銲錫是未被探討的。本實驗利用了微量毛細管設計了一個Cu/Sn/Cu結構,同時探討電遷移對液態、固態無鉛銲錫Sn-3.5Ag中Cu溶解現象的影響。我們利用維氏硬度計在Cu導線上打入marker以計算Cu導線溶解量,此marker與Cu導線頂端距離300 mm。在實驗中發現,試片於240 ℃下,施予電流密度6.3x103 A/cm2,會造成陰極端Cu導線相當嚴重的Cu溶解現象,通電時間達3 hr約有125 mm Cu導線溶解,並於陽極端生成大量IMC;相同的時間與電流密度,於185 ℃通電,陰極端Cu導線卻僅溶解1 mm;而在未通電的情況下,試片於255 ℃反應3 hr,Cu導線溶解約8.5 mm;相同的時間,試片於200 ℃,Cu導線溶解約1 mm;這表示電子流、熱效應對於Cu溶解現象有著交互的影響,本實驗對此現象作深入的探討,此現象有助於flip-chip銲點分析,進而對其毀壞機制的探討。這告訴我們,flip-chip銲點的毀壞,很有可能因電遷移造成銲點局部溶解,進而導致嚴重的Cu溶解現象,最後整個銲點失效。 The electromigration of solder at solid state was studied in the past, but it was not discussed at liquid state. In this study, we take the micro capillary to design a Cu/solder/Cu structure. We make the marker on the copper wire with the distance of 300
    Appears in Collections:[化學工程與材料工程研究所] 博碩士論文

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