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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/3916


    Title: Zn濃度對無鉛銲料與Cu界面反應之影響;Zn Concentration Effet on the Interfacial Reaction between Lead-Free Solders and Cu.
    Authors: 楊素純;Su-Chun Yang
    Contributors: 化學工程與材料工程研究所
    Keywords: 界面反應;;無鉛銲料;lead-free solder;interfacial reaction;Zn
    Date: 2007-06-27
    Issue Date: 2009-09-21 12:25:55 (UTC+8)
    Publisher: 國立中央大學圖書館
    Abstract: 自2006年7月1日開始,歐盟制定之危害物質限用指令(ROHS, Restriction of Hazardous Substance)正式開始實施,其中對微電子封裝影響最大的就是禁止”鉛(Pb)”的使用。過去已經使用五十多年之”鉛錫銲料”也將全部改成無鉛銲料。目前國際間各大工業聯盟似乎已達成一共識,未來將以SnAgCu系列之無鉛銲料來取代鉛錫銲料。 為了改善SnAgCu的銲接品質,在SnAgCu銲料中添加第四元素開始被提出,而Zn正是目前考慮添加的元素之一。然而關於添加微量的Zn對界面反應的影響則還不是很清楚,因此本研究就藉由改變Zn濃度來探討Zn對界面反應的影響。本研究採用五種不同的Sn-Zn銲料,Zn濃度分別為純錫,0.5,0.7,2以及9 (wt.%)。銲料與Cu片在250oC下反應2分鐘和10分鐘。反應結果發現,銲料中Zn濃度的些微改變會造成界面上的反應生成物截然不同。當Zn濃度高於2 wt.%,界面上的生成物為Cu5Zn8;當Zn濃度為0.7wt.%,CuZn及Cu6Sn5這兩種介金屬會同時在界面上生成;當Zn濃度低於0.5wt.%時,界面只會以單一的Cu6Sn5生成於界面上。對於上述的觀察結果,我們將以Cu-Sn-Zn的三元相圖給予一個合理的解釋。 此外,在銲料中添加微量的Zn也會造成固態反應有很大的改變。微量Zn的添加可以非常有效地抑制界面上與Kirkendall voids極為相關之Cu3Sn介金屬的生成,而液態銲料與基材反應若發生介金屬剝離的現象,也會影響之後的固態反應。根據本研究的結果,工業上若選擇Zn當作添加在SnAgCu銲料中的第四元素時,對於Zn濃度的添加要更加謹慎的評估。 The acute Zn concentration sensitivity of the reaction between Sn-based solders and Cu substrate is reported and explained in this paper. Three Sn-xZn solders (x = 0.5, 0.7, and 2 wt. %) were reacted with Cu substrates at 250oC for 2-10 mins. A slight variation in the Zn concentration changed the reaction product formed at the interface. When the Zn concentration was low (x = 0.5 wt. %), the reaction product was Cu6Sn5. When the Zn concentration was slightly increased to 2 wt. %, the reaction product became Cu5Zn8. When Zn concentration was in-between (x = 0.7 wt. %), Cu6Sn5 and CuZn co-existed. The above findings are explained using the Cu–Sn–Zn phase diagram. The implication is that the type of compound forms at the interface can be controlled by adjusting the Zn concentration of the Sn-based solders.
    Appears in Collections:[化學工程與材料工程研究所] 博碩士論文

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