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    题名: PECVD製備疏水硬質膜;Preparation of hydrophobic hard coating via PECVD
    作者: 陳志榮;Chih-Rung Chen
    贡献者: 化學工程與材料工程研究所
    关键词: 二氧化矽;疏水;硬度;電漿;silica;hardnes;hydrophobic;plasma
    日期: 2008-06-02
    上传时间: 2009-09-21 12:29:26 (UTC+8)
    出版者: 國立中央大學圖書館
    摘要: 本研究使用矽氧烷為單體,在RF鐘罩型反應器裡進行電漿輔助化學氣相沉積法(PECVD),目的為製備一具有良好機械性質且均勻之二氧化矽薄膜。內文分為二個主題探討,首先以二乙氧基二甲基矽烷(DEODMS)為前趨物在RF電漿源下製備二氧化矽薄膜,探討在不同的沉積位置、基材溫度及添加氧氣配比下沉積得到薄膜之性質差異,並利用電漿蝕刻基材或改質薄膜,改變薄膜表面的化學組成、硬度及接觸角等性質。接續,由上一主題選出較佳的電漿參數,探討使用各式矽氧烷單體為前趨物進行PECVD沉積時,薄膜性質之變化。 結果發現,當薄膜沉積位置為電漿區時,以DEODSM為單體可在基材溫度提高至200℃時達到8H的硬度,同時在基材溫度300℃時提高至9H;藉著添加氧氣混合單體至反應器中,可在氧氣與單體體積流率比為2時將薄膜硬度提高至8H,因為此操作條件不需在高溫下進行,可以應用於不耐熱的高分子基材。此外,利用電漿表面改質及TMCS溶液處理,可以控制薄膜的表面為親水性(7°)或疏水性(100°),若使用氧電漿預先蝕刻PP基材,則沉積薄膜之接觸角可提升至122°。除了控制電漿參數外,選用甲基三乙氧基矽烷(MTEOS)代替DEODMS為單體可在不改變溫度或添加氧氣下,一步驟得到4H的硬質膜。在此同時研究單體結構對薄膜整體化學組成及表面元素分佈之影響,藉著控制各類似矽氧烷單體及氧氣的比例,可以控制製備之薄膜的表面能及硬度。 Preparation of uniform silica films with high mechanical properties by plasma enhanced chemical vapor deposition (PECVD) at room temperature has been developed. At first, plasma parameters, different position, substrate temperature, and amount of oxygen were investigated using diethoxydimethylsilane (DEODMS) as monomer. In addition, these above films were treated by different plasma to study the influence of surface treatment on chemical structure and properties of films. On the other hand, oxygen plasma was also utilized to etch substrates to make rough surface. Finally, the films were deposited using four different monomers (tetraethoxysilane (TEOS), methyltriethoxysilane (MTEOS), DEODMS, ethoxytrimethylsilane(EOTMS)) with the best plasma parameters found before. The results showed that the films with hardness 8H were obtained via increasing substrate temperature to 200°C at plasma region, and promote hardness to 9H at 300°C. With adding 20 sccm oxygen into the reactor, the dense and transparent film with 8H hardness was obtained even at room substrate temperature. These above films with further plasma treatment and dipping them into TMCS solution were able to change surface energy of films to have water contact angle from 79° to 7°~100°. On the other hand, water contact angle of films was promoted to 121° via etching plastic substrate by oxygen plasma. The films deposited using MTEOS and without adding oxygen had the largest hardness 4H among the four monomers. With increasing the amount of oxygen in all four monomers, the hardness of the films was increased, and the water contact angle of films was decreased.
    显示于类别:[化學工程與材料工程研究所] 博碩士論文

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