本研究利用KrF準分子雷射（波長：248nm），對三種不同增層材料，進行雷射剝蝕鑽孔加工研究，求得各個的材料雷射加工特性：臨界起始能量密度、鑽孔蝕刻率、孔洞內之表面粗糙度，並且進行比對差異的分析研究。 在進行雷射鑽孔過程中，另外設計以加熱及冷卻方式，改變增層材料的雷射鑽孔環境溫度，藉此研究在不同環境溫度下，準分子雷射鑽孔加工之主要鑽孔機制為何？並觀察材料在不同溫度下進行鑽孔加工，是否會對其孔洞外觀、蝕刻率及表面粗糙度有所影響。 This research uses KrF laser (the wave length: 248nm) on the build-up material of three different components, and drilling holes on them. The result we can get bulid-up material's threshold energy, and compare the etch rate, the hole's surface roughness to the difference analytical study. In carry on the laser drilling process, we design heating and cooling condition. To change the laser drilling temperature environment, and takes advantage of the research under the different ambient temperature, what is the main mechanism to KrF laser drilling process? And observes the material to carry on the drilling process under the different temperature, whether to its hole outward appearance、the etch rate and the surface roughness has the influence.
