本研究是以太陽能級的多晶矽為研究材料，探討實驗參數對加工製程之影響，而本文主要分為兩大部份： 第一部份是將超音波振動結合線切割放電的複合加工技術，藉由超音波高頻率、微小振幅的振動作用，使放電線電極產生高頻振動，促使將放電所產生之加工屑振散，使其較容易被沖除，避免加工屑聚集而造成二次放電，冀望藉此提升整體的加工效率與加工精度。 第二部份即是利用電解加工方法，對線切割放電所造成的微裂痕進行蝕刻(Etching)與修平(Leveling)，實驗發現，電解液濃度為6M、加工電壓20V、加工間隙0.9mm、電極轉速0rpm、加工時間5min，可得到本實驗最佳表面粗糙度值，其表面粗糙度由4.83μm下降至3.67μm，其改善率為24.02%。 This research investigates the effect of operation parameters on poly-silicon. This paper is mainly divided into two major parts： The first part is studying of ultrasonic vibration-assisted wire electrical discharge machining, ultrasonic vibration was mounted on wire electrode of WEDM. Produce high-frequency and small periodic amplitude characteristic, can be working debris easy flushed and avoid secondary discharge, in hopes of improving the machining efficiency and accuracy in the technology. The second part is the surface carries on etching and leveling after WEDM by the electrolytic machining. According to the result, when machining voltage of 20V、electrolyte concentrate of 6M、machining gap of 0.9mm、electrode rotational speed of 0rpm and machining time of 5min can be improved from 4.83μm(Ra) to 3.67μm(Ra)and surface roughness improvement rate up to 24.02%(Ra).
