雷射掃描晶圓定位系統; Wafer Positioning by Laser Scanning Method

NCUIR > Engineering College > Graduate Institute of opto-Mechatronics > Electronic Thesis & Dissertation > Item 987654321/47536

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/47536

Title:	雷射掃描晶圓定位系統;Wafer Positioning by Laser Scanning Method
Authors:	陳建佑;Jian-You Chen
Contributors:	光機電工程研究所
Keywords:	晶圓定位;雷射掃描;散射光時序訊號;Scattering Light Signal;Wafer Positioning;Laser Scanning Method
Date:	2011-11-14
Issue Date:	2012-01-05 11:22:06 (UTC+8)
Abstract:	本論文提出一雷射掃描晶圓定位系統用來量測集束型設備中晶圓的圓心位置。此定位系統是由雷射掃描系統與散射光偵測系統組成。利用振鏡掃描器將雷射光線反射至感測區域形成一道掃描光線。當機械手臂輸送晶圓通過掃描光線時，散射光偵測系統將接收到一光強度隨時間變化之散射光時序訊號。根據散射光時序訊號與已知的速度及位置參數，晶圓位置演算法便可計算出機械手臂運動速度與晶圓圓心位置。為驗證系統之定位能力，使用四吋晶圓進行實驗。在以實驗速度為速度參數之實驗中，定位精確度小於1.5mm；在以理論速度為速度參數之實驗中，定位精確度則皆小於0.1mm。本系統亦可用於速度量測，速度量測之絕對誤差小於1mm/s，量測精確度則低於0.7mm/s。 A laser scanning method for wafer positioning is proposeed to determine the center position of the wafer in the cluster tool. This positioning system incorporates a laser scanning system and a scattering light receiving system. The scanner is used to reflect a laser beam into a scanning line on the sensing area. As the wafer passes by the scanning line, a scattering light receiving system detects the time-sequence signal of the scattered lights. The velocity of a robot plate and the position of wafer ia determined by signal processing of the time-sequence signal. 4-inch wafer positioning experiment results demonstrate that the positioning system can be used to detectc the positioning of a wafer. The velocity measurement precision is under 0.7 mm/s, and the absolut error is about 1 mm/s. The wafer positioning precision is 0.1 mm.
Appears in Collections:	[Graduate Institute of opto-Mechatronics] Electronic Thesis & Dissertation

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