Study of Interfacial Reactions Between Sn(Cu) Solders and Ni-Co Alloy Layers

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Title:	Study of Interfacial Reactions Between Sn(Cu) Solders and Ni-Co Alloy Layers
Authors:	Huang,KC;Shieu,FS;Huang,TS;Lu,CT;Chen,CW;Tseng,HW;Cheng,SL;Liu,CY
Contributors:	化學工程與材料工程學系
Keywords:	BUMP METALLIZATION;SN;JOINTS;RELIABILITY;SUBSTRATE;CU
Date:	2010
Issue Date:	2012-03-27 16:26:04 (UTC+8)
Publisher:	國立中央大學
Abstract:	The interfacial reactions between electroplated Ni-yCo alloy layers and Sn(Cu) solders at 250 degrees C are studied. For pure Co layers, CoSn(3) is the only interfacial compound phase formed at the Sn(Cu)/Co interfaces regardless of the Cu concentration. Also, the addition of Cu to Sn(Cu) solders has no obvious influence on the CoSn(3) compound growth at the Sn(Cu)/Co interfaces. For Ni-63Co layers, (Co,Ni,Cu)Sn(3) is the only interfacial compound phase formed at the Sn(Cu)/Ni-63Co interfaces. Unlike in the pure Co layer cases, the Cu additives in the Sn(Cu) solders clearly suppress the growth rate of the interfacial (Co,Ni,Cu)Sn(3) compound layer. For Ni-20Co layers, the interfacial compound formation at the Sn(Cu)/Ni-20Co interfaces depends on the Cu content in the Sn(Cu) solders and the reflow time. In the case of high Cu content in the Sn(Cu) solders (Sn-0.7Cu and Sn-1.2Cu), an additional needle-like interfacial (Ni(x),Co(y),Cu(1-x-y))(3)Sn(4) phase forms above the continuous (Ni(x),Cu(y),Co(1-x-y))Sn(2) compound layer. The Ni content in the Ni-yCo layer can indeed reduce the interfacial compound formation at the Sn(Cu)/Ni-yCo interfaces. With pure Sn solders, the thickness of the compound layer monotonically decreases with the Ni content in the Ni-yCo layer. As for reactions with the Sn(Cu) solders, as the compound thickness decreases, the Ni content in the Ni-yCo layers increases.
Relation:	JOURNAL OF ELECTRONIC MATERIALS
Appears in Collections:	[化學工程與材料工程學系 ] 期刊論文

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