中大機構典藏-NCU Institutional Repository-提供博碩士論文、考古題、期刊論文、研究計畫等下載:Item 987654321/50927
English  |  正體中文  |  简体中文  |  Items with full text/Total items : 80990/80990 (100%)
Visitors : 41647600      Online Users : 2302
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version


    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/50927


    Title: Sensitivity Enhancement for Quantitative Electrochemical Determination of a Trace Amount of Accelerator in Copper Plating Solutions
    Authors: Chiu,YD;Dow,WP;Huang,SM;Yau,SL;Lee,YL
    Contributors: 化學學系
    Keywords: SELF-ASSEMBLED MONOLAYERS;VOLTAMMETRIC STRIPPING ANALYSIS;POLYETHYLENE-GLYCOL;CHLORIDE-ION;DISULFIDE ADSORPTION;CU ELECTRODEPOSITION;ORGANIC ADDITIVES;ASPECT-RATIO;SEED LAYER;ACID
    Date: 2011
    Issue Date: 2012-03-27 18:13:04 (UTC+8)
    Publisher: 國立中央大學
    Abstract: An accelerator is an indispensable organic additive for the bottom-up filling of copper electroplating in nano-or micro-scale features. However, its effective concentration is too low to be easily determined and controlled. Herein, a new electrochemical analysis method based on self-assembly monolayers of thiol molecules on a gold electrode was developed to accurately determine a trace amount of accelerator. The accelerator employed in copper plating solutions is bis-(3-sulfopropyl) disulfide (SPS), which is the most common accelerator for the filling of vias and trenches of interconnects. The SPS concentration in copper plating solutions ranged from 0.3 to 9.0 ppm. Following selective chemisorption of SPS onto the gold electrode, the SPS-modified gold electrode was transferred into a specific electrolyte composed of CuSO(4), H(2)SO(4), polyethylene glycol and chloride ions to run cyclic voltammetry (CV) for copper deposition and stripping. A specific peak current of copper reduction formed in the CV, and its peak area depended on the SPS concentration in the copper plating solution. A good linear calibration line was obtained by using this electrochemical analysis method, which can determine a trace amount of SPS in a concentration range of 0.3-1.0 ppm, which is a significant challenge for traditional instruments. (C) 2011 The Electrochemical Society. [DOI: 10.1149/1.3560479] All rights reserved.
    Relation: JOURNAL OF THE ELECTROCHEMICAL SOCIETY
    Appears in Collections:[Department of Chemistry] journal & Dissertation

    Files in This Item:

    File Description SizeFormat
    index.html0KbHTML455View/Open


    All items in NCUIR are protected by copyright, with all rights reserved.

    社群 sharing

    ::: Copyright National Central University. | 國立中央大學圖書館版權所有 | 收藏本站 | 設為首頁 | 最佳瀏覽畫面: 1024*768 | 建站日期:8-24-2009 :::
    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - 隱私權政策聲明