| 摘要: | 本研究以印刷電路板業之鍍銅設備火災為例，探討保護層分析在鍍銅設備火災預防的應用成效，並以危害與可操作分析做初步危害分析手法，以失誤樹做保護層失效率分析手法。就研究顯示，鍍銅設備火災危害主要來源為加熱器、化學品不相容反應與低燃點藥液遭遇明火。保護層分析的效益，在未實施前，其火災風險的每年發生機率高達1.0301X10-2，經保護層分析並改善後，火災風險的每年發生機率則降為4.01X10-6。 綜整電子產業火災發生事件與文獻的探討，得知設備火災危害的起因。以燃燒理論的構面來看起始危害，熱源構面為化學品反應、加熱器乾燒與電氣設備短路，連鎖反應構面為化學品反應，助燃物構面則包含一般空氣與化學品反應，雙氧水的反應特性則存在於這三個構面中。 保護層分析技術在人員操作偏離的分析與應用時，有它的局限性，故該類偏離的預防，除建議增設儀表功能輔助外，人員作業的防呆性，更應慎重考量。另本研究發現，保護層分析應用於電子產業設備火災預防分析時，先釐清情境危害的發生原因，再做初步的危害分析，有助於避免初步的危害分析方向偏離，並可提昇接續的保護層分析效率。 關鍵詞：印刷電路板、鍍銅設備、設備火災、風險分析技術、 危害與可操作分析、保護層分析、失誤樹分析This case study is intent to investigate the effectiveness of LOPA (Layer of Protection Analysis) for fire prevention on equipment of copper plating line in PCB industry. The methodologies applied in the study include: HAZOP (Hazard and Operability Study) for preliminary damage assessment, FTA (Fault Tree Analysis) for LOPA failure analysis. Statistical and anecdotal evidences show that most fires occur in copper plating line is caused by malfunctioned heaters, unintended chemical reactions, or flammable chemicals. Prior to carry out LOPA, the probability of fire incidence for copper plating line is 1.0301X10-2, and is reduced to 4.01X10-6 after LOPA was implemented. Through the literature survey and the summary of fire events in electronics industry, it was able to realize the possible causes of equipment fires. From the perspective of combustion theory, there are three aspects of hazard initiation. The aspect of heat sources comprises chemical reaction, overheating, and short circuit of electronics parts. The aspect of chain reactions includes various chemical reactions. While the aspect of combustion-supporting element comes from oxygen generated when air reacts with chemicals, or from H2O2 interacting with chemicals. The applications of LOPA and corresponding analysis have their limitations, especially in case of mistakes cause by operators or operation deviates from specification or requirement. Thus, aiming to reduce such occurrences, fool-proof methodology that can mitigate mistake deserves careful planning, while adopting automatic measuring equipment and sensors can as additional assistance. Other key findings of this study suggest that the possible causes of damage scenario shall be identified prior to carry out preliminary damage assessment for the equipment related to fire prevention and analysis in the electronics industry, so that can better target on preliminary damage assessment and enhance the efficiency of following LOPA,. Key words: PCB (Printed Circuit Board), copper plating equipment, equipment related fire, risk assessment techniques, HAZOP (Hazard and Operability Study), LOPA (Layer of Protection Analysis), FTA (Fault Tree Analysis) |
