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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/61692


    Title: 直下式LED液晶觸控顯示器之研究
    Authors: 黃柏書;Huang,Po-Shu
    Contributors: 機械工程學系在職專班
    Keywords: 發光二極體;液態光學膠;直下式背光模組;均勻度;Light Emitting Diode;Liquid Optically Clear Adhesive;Direct-type backlight module;Uniformity
    Date: 2013-08-26
    Issue Date: 2013-10-08 15:28:39 (UTC+8)
    Publisher: 國立中央大學
    Abstract:   觸控面板顯示器裝置例如平板電腦及智慧型手機、一體成型電腦等,對於高穿透色彩品質、高對比、省電、快速啟動等特性的需求之下,全貼合液態光學膠與發光二極體是現階段最被看好的關鍵材料。
    發光二極體使用於背光模組光源上,目前市面上產品已常見應用於側光式背光模組,至於發光二極體應用在直下式光源設計上,因發光二極體的光具指向性及點光源之特性,引發輝度、色度不均及模組厚度不易薄型化等設計瓶頸問題,故尚未普及。然而液晶顯示器模組背光光源的光線由顯示面板進入與通過空氣間隙時產生散射與光線損失,因而降低螢幕的顯像品質。
    本論文研究的重點在於利用光學模擬軟體,分析並設計出發光二極體透鏡結構,使光經由此透鏡結構,將光線均勻分佈於背光模組空腔之中,並搭配液態光學膠全貼合製程實驗,找到最佳貼合參數防止溢膠以及膠厚不均等問題,達到模組輝度均勻化與厚度減薄及同時兼顧到高顯像品質的目的。
    Touch panel display device such as tablet and smart mobile phone and all in one(AIO) computer and so on, that under the needing of characteristics try to get high transmittance colors quality, high contrast, power saving and fast booting. Full lamination liquid optically clear adhesive(LOCA) and Light Emitting Diode(LED) are the most favored of the key materials.
    LED light source used in the backlight module, currently available products have been commonly used in edge-type backlight module.As for the LED used in the design of direct-type light source, because of the LED light source are directivity and point light source characteristics, triggered the luminance, chromaticity and uneven, difficult to module thickness thin etc. design bottleneck , so it is not yet universal. However, LCD backlight module light from the light source into the display panel is generated through the air gap and the loss of light scattering, thereby reducing the imaging quality of the screen.
    The focus of this thesis is to use the optical simulation software to analyze and design the LED lens structure, the structure of the light through this lens, the light is evenly distributed among the backlight cavity, and with LOCA bonding process experiment to find the best fit parameters to prevent excess glue and adhesive thickness inequality issues, achieve uniform brightness modules with thinning and while the purpose of achieving high quality imaging.
    Appears in Collections:[Executive Master of Mechanical Engineering] Electronic Thesis & Dissertation

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