研究期間：10308~10407;This project will investigate the applications of Pb-free solders on the 3 dimensional packaging in the devices and green technology. The researches will be conducted with the aid of synchrotron sub-micron X-ray diffraction technique in Taiwan Photon Source. In 3D-IC, the study will emphasize the impact to the reliability with the shrinking dimensions of the solders. The results can be used to establish the failure mode of the devices. The topic will also cover the influences of the electrical and thermal effect on the kinetics of the interfacial intermetallic compound formation. Tin whisker is also an important issue that can be seen on the surfaces of the microbumps under room temperature storage. The study will discuss the spontaneous growth mechanism and the relation with the stress distribution. The well controlled samples can be utilized to in-situ analyze the fundamental properties of the nucleation and the growth of whiskers. The project will explore the applications of Pb-free solders in the energy related materials. By joining the solders with Bi2Te3 thermal electric materials, the interfacial diffusion barrier is critical to the mechanical reliability. The electromigration test on the systems will yield a systematic analysis of the failure mode.
