研究期間：10108~10207;The purpose of this study is to investigate the application of ferroelectric and ferrite thin-films to the power integrity and electromagnetic interference (EMI) reduction of multi-chip modules. Ferroelectric thin-film exhibits high dielectric constant, and can be used to implement miniature and ultra-thin de-coupling capacitor. Ferrite thin-film possesses high permeability, and can be applied to the design of miniature EMI filters. A proper combination of ferroelectric and ferrite thin-films has the potential to realize highly integrated power integrity and EMI solutions for multi-chip module applications. Compared to the conventional designs of multi-chip modules that focus on the implementation of embedded passives in the module substrate and connect the active circuit chips through wire-bonding or flip-chip, the proposed technology introduce the possibility to also integrate power integrity and EMI solutions in the module substrate throught the use of advanced ferroelectric and ferrite thin-film processes. In this way, a complete “system-on-package” archtecture can be delievered, and it represents a major leap forward in terms of the level of integration for system-in-a-package technologies.