| 摘要: | 為尋找新的表面處理技術以運用於印刷電路板，含Co及Pd之基材為考量之一。本研究之基材選用以無電鍍Co為基礎的四種不同表面處理系統，分別為無電鍍鈷 (Electroless Cobalt，EC)、無電鍍鈷/浸金 (Electroless Cobalt/Imersion Gold，ECIG)、無電鍍鈷/無電鍍鈀 (Electroless Cobalt/Electroless Palladium，ECEP) 、無電鍍鈷/無電鍍鈀/浸金 (Electroless Cobalt/Electroless Palladium/ Imersion Gold，ECEPIG)。本研究將探討四種不同無電鍍Co系統與Sn-3.0Ag-0.5Cu無鉛銲料在固/固之界面反應變化。
研究結果顯示無電鍍Co系統在固/固界面反應中，因受到介金屬化合物成長與剝離於界面相互競爭之影響，介金屬化合物總厚度呈現不規則變化。銲料與(Co,Cu)Sn3或(Co,Cu,Pd)Sn3 之間的界面上偏好生成(Co,Cu)6Sn5或(Co,Cu,Pd)6Sn5。隨著退火溫度上升或退火時間增加，(Co,Cu)6Sn5或(Co,Cu,Pd)6Sn5厚度也隨之增加。
;Surface finishes containing Co and Pd are new candidates for printed circuit boards. This study investigated the solid state interfacial reaction between Sn-3.0Ag-0.5Cu Pd-free solders and four different Co-based surface finishes, such as electroless Co (EC), electroless Co/immersion Au (ECIG), electroless Co/electroless Pd (ECEP), and electroless Co/electroless Pd/immersion Au (ECEPIG).
The results showed that the thickness of the total intermetallic compound thickness could be affected by the spalling and the growth of the compounds in four different Co-based surface finishes. (Co,Cu)6Sn5 and (Co,Cu,Pd)6Sn5 would form at the interfaces between the solder and (Co,Cu)Sn3 or (Co,Cu,Pd)Sn3. Prolonging the aging time or raising the aging temperature would result in the increase of the (Co,Cu)6Sn5 and (Co,Cu,Pd)6Sn5. |
