近年來，以SOI基板之晶片上光連接模組也日益受到關注，為了達到單晶片光連接模組的高靈活性與高集合性，光波導上的分光結構成為單晶片模組裡不可或缺的部分。於是本研究中提出以矽基垂直分岔波導實現具13輸出埠之三維光路。此光路包含了具45微反射面之分光結構和具45轉折反射面之梯形脊狀波導，未來便可整合雷射光源、光偵測器和積體電路於單晶片模組，其為光學連接技術領域首次達成在單一通道上以矽基垂直分岔波導實現具13輸出埠之三維光路。 在本論文探討的光路架構中，光訊號先穿過基板，經由45反射面耦合至矽波導中，在藉由矽波導上的分光結構垂直反射至接收端，實現具垂直分光的三維光路，本光路使用SOI晶圓當作基板，在光子元件層使用非等向性濕蝕刻製程二次步驟製作出具垂直分光結構的光波導。 根據光學模擬和光學量測結果，在本論文提出的具13輸出埠之三維光路中，各輸出埠之光學耦合效率分別為 -10.8 dB、-11.74 dB、-8.45 dB。未來可將此高光學品質的具13輸出埠之三維光路應用在單晶片架構上。 ;SOI-based optical interconnects for on-chip applications have been attentions in recent years. In order to achieve the high flexibility and compact integrations in the on-chip optical-interconnect systems, optical waveguide splitters are important component in the on-chip systems. We demonstrate the three-dimensional optical path with 13 output ports using SOI-based vertically-splitting optical waveguides. The vertically-splitting optical waveguides include 45-dgree micro-splitters and 45-degree reflecting trapezoidal waveguides, and integrate vertical-cavity surface-emitting laser (VCSEL), photodiode (PD), integrated circuit (IC) in one silicon substrate in the future. It is first time to demonstrate 1multiple optical routing structure in one channel. In the proposed optical waveguides, optical path penetrates through the substrate and coupled into the silicon waveguide, then vertically reflected to the receivers by splitting structure in the silicon waveguide to realize vertically-splitting three-dimensional optical waveguides. The SOI-based vertically-splitting waveguide is fabricated on an orientation–defined (100) SOI substrate using a two-step anisotropic wet-etching process. According to the optical simulated and experiment results, in the 13 output ports using SOI-based vertically-splitting optical waveguides, the optical coupling efficiency of output ports achieve -10.8 dB, -11.74 dB and -8.45 dB. This high optical–quality 13 output ports using SOI-based vertically-splitting optical waveguides will be realized in the On-chip interconnect module.
