刀鋒式100Gb 光纖乙太網路交換機硬體設計之研究;Study of Blade Fiber Switch Hardware Design for 100 Gigabit Ethernet

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題名:	刀鋒式100Gb 光纖乙太網路交換機硬體設計之研究;Study of Blade Fiber Switch Hardware Design for 100 Gigabit Ethernet
作者:	陳建宏;Chen,Chien-Hung
貢獻者:	光電科學與工程學系
關鍵詞:	乙太網路;網路交換機;印刷電路板;熱流;電源電路;Ethernet;Ethernet Switch;PCB;Thermal Flow;Power Circuit
日期:	2014-07-25
上傳時間:	2014-10-15 14:41:52 (UTC+8)
出版者:	國立中央大學
摘要:	近年隨著個人手持裝置的廣泛使用，連帶引起許多效應，而這些效應正急速改變著我們的生活方式。當大家不需要網路線才能上網，也不需要跑到特定的熱點才能讓自己的手持裝置連上網路，現在我們生活的周遭圍繞著這些看不見、摸不著卻又輕易讓每個人所使用的無線網路平台，而大多數人不知道這些資料傳輸其實不停地在中央機房裡以高速的流量反覆地接收、發射到你我的面前，因此在機房中的網路交換機便是在這資訊快速交換的時代裡不可或缺的角色。本論文以刀鋒式100Gigabit光纖網路交換機為主題，研究其硬體之設計，從構想、規劃到成品完成，從中建立出零件佈局、PCB設計、熱流改善、訊號完整度、電源電路五大設計重點。在成品的量測結果，每組電源均得正常運作且不超越額定功率，時脈信號皆符合晶片規格且不受雜訊干擾，傳輸訊號符合 IEEE 802.3 標準規範，主晶片的實測平均工作溫度與模擬平均值僅有 0.3% 的誤差。100Gigabit 為目前最高速的乙太網路交換機，以此硬體設計為題，從設計過程中所面臨的各種問題，並找出其解決方案，將其作為爾後硬體進階的基石。;The widespread use of personal handheld devices brings about many effects nowadays. These effects are rapidly changing the way we live.The networking cable is not needed to connect the device on our hand and the Ethernet equipment. The specific area is not required to access the internet. We live in a world surrounded with wireless network platform.Nevertheless, most people do not know how the data is received and transmitted with high-speed flow repeatedly in the datacenter. It is the Ethernet switch that takes the role to make it happen. Being the most advanced and fast Ethernet switch, the blade-100Gigabit optical fiber network switch is the object in this thesis which studies the hardware design from planning to the physical output. There are five design process built to be discussed, includingcomponent placement, PCB layout design, thermal flow improvement, signal integrity optimization, and power supply circuit.With regard to the measurement result, each group of power operates normally and does not exceed the rated power. The clock signal meets the specification of the chip, and is not disturbed by the noise. The traffic signal conforms to the IEEE 802.3 standard.There is only 0.3% deviation between the measuredaverage operating temperature of the chip and the simulation average result.By discovering the issues and working out the solutions during the design process, this thesis provides the design method and reference data for more modern and high-tech hardware design in the future.
顯示於類別:	[光電科學研究所] 博碩士論文

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