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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/6699


    Title: 光學薄膜應力量測與分析之探討;The measurement and analysis of Stress for Optic Thin Film
    Authors: 潘鼎翔;Ding-Shang Pan
    Contributors: 光電科學研究所
    Keywords: 應力量測;干涉儀;Zernike 多項式;相位還原演算法;Zernike polynominal fitting;stress;PSI
    Date: 2003-06-25
    Issue Date: 2009-09-22 10:26:10 (UTC+8)
    Publisher: 國立中央大學圖書館
    Abstract: 本論文探討利用Twyman Green干涉儀,配合相位偏移技術,擷取干涉圖形,在經由Hariharan相位還原法,分析干涉圖形,可得到其相位圖,並可知其基板的表面輪廓,而經由測定基板在鍍膜前後的面形變化量,求的其應力值。另利用Zernike 多項式擬合法,來扣除人為的誤差,如傾斜,離焦等…其方法比其他的量測技術上,更為精確。接著則利用電子鎗蒸鍍薄膜材料在配合離子輔助鍍膜系統,製鍍光學薄膜,利用不同的回火溫度來作處理,來尋求其高折射率、低吸收、低表面粗糙度、低應力的光學薄膜。 The thesis make use of Twyman Green interferometry and phase shift interferometry to grab interferogram. By Hariharan PSI algorithm we can analyze interferogram in order to get the phase map and know the substr- ate contour map. The stress in thin film can be derived by comparing the deflection of the substrate before and after film deposition . We also use Zernike polynomial fitting algorithm to remove errors,such as tilt and dfocus.Compared with other techniques,the present method is more accurate.we use e-beam evaporation(PVD) with ion-assisted deposition(IAD) to evaporate optical thin film,by using diffenent baking temperature to find high refractive index、low extinction coefficient、low roughness、and low stress in the optical thin film.
    Appears in Collections:[光電科學研究所] 博碩士論文

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