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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/6715

    Title: 真空鍍膜厚度均勻性的電腦模擬
    Authors: 葉禮維;David Yeh
    Contributors: 光電科學研究所
    Keywords: 均勻性;膜厚;uniform;thickness
    Date: 2002-06-14
    Issue Date: 2009-09-22 10:26:34 (UTC+8)
    Publisher: 國立中央大學圖書館
    Abstract: 摘要 對於光學薄膜而言其光學特性對厚度的變化很敏感,因此,要製鍍一大面積的薄膜,由於膜厚均勻之不同,將使可用面積變得很有限。尤其對於多層膜的製鍍,因為必須用到多個不同材料蒸發源,對於不同材料具有不同的發射特性,造成不同膜層膜厚分布不同,對於控制各膜層之均勻性分布將是一大挑戰。 首先吾人對基板相對蒸發源的幾何位置擺設所造成的影響加以分析,進而探討蒸發源特性及成膜過程之物理特性。以作為設計改善膜厚均勻性時之參考,而達成改善厚度分布均勻性之目標。 本論文使用不同尺寸的遮板分別置放在靶源與基板之間,探討薄膜隨著不同位置尺寸的遮板對於薄膜厚度分佈的影響。我們發現薄膜厚度分佈會隨著遮板架設的位置及尺寸外形的不同而有所改變,因此膜厚均勻性可以使用適當的遮板改善。 Abstract Since the uniform of thickness is different in every position on the thin film, useful area maybe small in a large area thin film application. In order to making multi-layer thin film, we have to use different material that has different emitter factor such that the thickness distribution will be un-uniform. It is a challenge to making control of the thickness distribution. First, we discuss the effect about the position condition of thickness distribution structure. We analysis the process of the thin film deposition. By using above condition, we design some experiments to improve the uniform of thickness. We use mask with different size and different position between source and target . Since we find that thickness will be change by the size and position of mask . We can use mask to improving the uniform of thickness.
    Appears in Collections:[光電科學研究所] 博碩士論文

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