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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/6731

    Title: 以乾蝕刻製作微透鏡陣列之技術與量測Fabrication;and Measurement of microlens with dry etching
    Authors: 陳仁祿;Ren-Lu Chen
    Contributors: 光電科學研究所
    Keywords: 微透鏡;microlens
    Date: 2003-07-10
    Issue Date: 2009-09-22 10:27:00 (UTC+8)
    Publisher: 國立中央大學圖書館
    Abstract: 本論文是在矽基板上用乾蝕刻方式製作微透鏡陣列的模具,形狀為平凹球面,亦可當凹面鏡使用。利用SF6/C4F8混合氣體電漿,調整蝕刻氣體流量、蝕刻時間、上下電極瓦數會造成微模具曲率半徑的改變。 主要利用乾蝕刻的isotropic etching,所以製作出的樣品的底切現象仍相當嚴重,且蝕刻面的可用範圍有限。在一系列的微透鏡樣品中,其中有個樣品利用干涉儀所量測之相位差小於一個波長,其光學性質經量測及計算後,微透鏡的有效直徑(clear aperture)約為130μm,焦距是116μm,其所對應的N.A為0.56。 Using ICP dry etch technology to fabricate concave lens on silicon wafer. Try to make spherical or aspherical microlens having different radius of curvature. We use a Twymann-Green interferometer to measure the surface profile.
    Appears in Collections:[光電科學研究所] 博碩士論文

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