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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/68076

    Title: 應用實驗計畫法- 提升垂直電漿機在IC載板上清潔能力之研究
    Authors: 温玉帆;Wen,Yu-fan
    Contributors: 工業管理研究所在職專班
    Keywords: IC載板;電漿;實驗計畫法;可靠度
    Date: 2015-07-28
    Issue Date: 2015-09-23 10:24:54 (UTC+8)
    Publisher: 國立中央大學
    Abstract: IC載板或稱IC基板,為IC裝構重要的零組件,主要功能為承載IC做為載體之用,並以IC載板內部線路連接晶片與印刷電路板(PCB之間的)訊號,其占封裝製程35%~55%成本,其主要功能在保護電路、固定線路與產生散熱途徑以保護IC,是封裝製程中的關鍵零件。由於科技的進步,IC愈趨精密,要發揮極致產品的功能,就需要精密封裝技術及良好效能的IC載板。
    ;IC substrates are the critical interface between the semiconductor chip and the conductive component carrier they rest on. IC substrates serve as the connection between IC chip (s) and the PCB through a conductive network of traces and holes.
    IC substrates support critical functions including circuit support and protection, heat dissipation, and signal and power distribution. From cost performance point of view, IC substrate accounts for about 35% - 55% of the total cost of IC package process.
    Along with the development of scientific and technological progress, IC packages become increasingly complex. Optimum performance of the product may need IC substrates, which are efficient and precise.
    It will cause pollution or foreign objects left on the surface during the IC substrate fabrication due to a variety of factors. Not only it results in an unacceptable cosmetic defect, but also reduces solderability to affect the reliability and the performance of the product.
    This study aims to plasma- cleaning treatment performances on vertical plasma cleaner. In this study we attempt to optimize the gas settings of vertical plasma cleaner with DOE (Design of Experiment). This is meant to solve the problem, which the production line is fully booked by using horizontal plasma cleaner.
    Appears in Collections:[工業管理研究所碩士在職專班 ] 博碩士論文

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