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    题名: 無鉛銲料與無電鍍鈷基板於多次迴焊之界面反應與可靠度測試
    作者: 蔡宜伶;Tsai,Yi-lin
    贡献者: 化學工程與材料工程學系
    关键词: 無電鍍鈷;可靠度
    日期: 2015-07-28
    上传时间: 2015-09-23 10:48:50 (UTC+8)
    出版者: 國立中央大學
    摘要: 本研究利用Sn-3.0Ag-0.5Cu (SAC305)與無電鍍鈷基板進行多次迴焊,探討其界面反應與微結構變化對於接點機械性質之影響。無電鍍鈷系統包含無電鍍鈷(Electroless Co,EC)、無電鍍鈷/浸金(Electroless Co/Immersion Au,ECIG)、無電鍍鈷/無電鍍鈀(Electroless Co/Electroless Pd,ECEP)無電鍍鈷/無電鍍鈀/浸金(Electroless Co/Electroless Pd/Immersion Au,ECEPIG)四種。其中無電鍍鈷層含有微量元素鎢、磷,即Co(W,P)層。實驗結果顯示,在較高的P含量中添加鈀層之系統(ECEP、ECEPIG),多次迴焊後介金屬化合物(Co,Cu,Pd)Sn3會發生大規模剝離現象,且在推力測試結果中以延性破壞為主,相較於無添加鈀的系統(EC、ECIG)以及較低P含量的ECEPIG有較高的推力值。鈀層的添加與較高的P含量會促使介金屬化合物產生大規模剝離,因此界面由原本的介金屬化合物/基板轉變為SAC305銲料/基板,破壞行為則由脆性轉變為延性,並提升了接點的機械強度。;This study investigated the evolution of microstructure of the intermetallic compounds formed between Sn3.0Ag0.5Cu solder and Co-based surface finishes. The influence of massive spalling of intermetallic compounds (IMCs) on the mechanical properties of solder joints was also studied. The SAC305 reflowed on four kinds of Co-based surface finish substrates, electroless Co (EC), electroless Co/immersion Au (ECIG), electroless Co/electroless Pd (ECEP), electroless Co/electroless Pd/immersion Au (ECEPIG). The CoSn3 was the main intermetallic compound (IMC) in the systems, and the CoSn3 would spalling massively in some specific substrates during multiple-reflows. The results indicated that the occurrence of massive spalling in IMCs relies on the addition of Pd layer and the P content on Co-based surface finishes. To understand the relationship between the evolution of microstructure and the mechanical strength of solder joints, the shear test was used to measure the mechanical properties. The results of shear test showed that the massive spalling of CoSn3 could transform the failure mode from brittle to ductile and enhance the shear strength of joints.
    显示于类别:[化學工程與材料工程研究所] 博碩士論文

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