本論文利用發光二極體的光源特性(Light Emitting diode, LED)，建立半球殼螢光粉封裝的熱功率密度分佈數值模型，並以蒙地卡羅法(Monte Carlo method)解決其他封裝結構數值模型的應用問題。再以有限元素分析(finite element analysis, FEA)軟體模擬LED的溫度分布，針對LED操作的電功率、功率轉換效率、螢光粉的量子效率與封裝膠的熱傳導係數作參數掃描分析。最後改變封裝的幾何結構，以半球殼封裝(Remote-dome phosphor package)、圓形平板封裝(Circular plate package)、半球封裝(Half-dome phosphor package)與表面封裝(Conformal coating package)為主，探討LED的電性、封裝的材料與幾何對LED溫度分布的影響。;This research uses the properties of LED light sources to build a numerical model of the thermal power density for remote-dome phosphor package. Monte Carlo method is applied to solve the thermal power density for the other phosphor packaging method. Finite element analysis software is used after to simulate the temperature distribution of LEDs to analyze with scanning the parameters of electric power, power efficiency, and quantum efficiency of phosphor and the thermal conductivity of the adhesive used. Furthermore, the geometrical structure of the phosphor packaging is change. The packaging methods are based on remote-dome, circular plate, half-dome and conformal coating. How the temperature distribution in LEDs will affected by electric properties, packaging material and geometrical structure are discussed in this research as well.
