本論文提出一套新的方法量測軟性基板薄膜應力，此方法能在不施加外力，物體呈懸吊狀的方式，以等高線圖標定物體的表面輪廓，利用數學技巧，進而將物體的曲率半徑算出。本文提出的陰影疊紋法不易受到外界環境干擾而影響，並具有一般干涉儀之非破壞性、操作方便等優點。利用已知曲率的物體進行量測系統的校正，以期量到正確的曲率半徑，而得知軟性基板薄膜應力數值以及型態；量測程式以Labview圖控程式寫成，擷取影像訊號並利用Labview內建的影像處理技術來消除雜訊，提高亮紋與暗紋間之對比度，減少量測上的誤判而產生的誤差，以增進量測解析度。 We propose a new method measuring thin film stress on flexible Substrates. The method defines the profile of the substrate by contour lines without using external force on it, and then we calculate the radius of curvature according to those contour lines. The shadow moiré method isn’t sensitive to the environment noise and has the same advantages as the interference method, such as non-destruction and easy-use. The measurement system is checked by the body whose radius is known in order to measure the correct radius of curvature in our experiments and then we will get the correct magnitude and type of thin film stress. The major computer codes are written by Labview, and it helps us getting the image signal automatically. With Labview image process technology, we remove the noise caused by laser and the optical components and increase the contrast of fringes to improve the resolution of the measurement instrument.
