隨著電腦的運算速度高達數GHz以上，傳統利用銅線傳遞電訊號的頻寬將不敷使用，利用光作為高速傳遞媒介之光連結技術將大幅取代IT產品中之各種訊號的連結。使用矽基材作為光連結技術的平台將享有可微型化、散熱佳等優勢，且可套用標準半導體製程技術達到元件的高精度定義、與可批次量產等特性。 本論文具體實現一個矽基微光學平台之光學連結技術，利用自由空間的光學傳遞，它可以作為板對板、或USB 3.0之光學連結技術的一個應用平台。在架構上，這個矽基微光學平台之光學連結收發模組包含有：單石積體化之45°微反射面、置放光纖陣列之V型凹槽、具2.5 GHz之高頻傳輸線與錫金焊料等，並可經由適當之光學對位鍵將面射型雷射與光偵測器封裝鍵結至微光學平台上。而矽基光學平台已完成2.5 GHz/channel的傳輸速度。 而經由設計的矽基微光學平台之45∘微反射面將具有110 ?m，而實驗製程之誤差可控制在6%的等級。經由光學追跡模擬的結果顯示，發射端的耦光效率為-6 dB，接收端的響應度為-2 dB。With the computing speed of computers up to several GHz and above, the telecommunications bandwidth through the traditional copper wire will be inadequate. Thus, incorporating optical light as a transmitting media will substantially improve most current interconnect technology due to its high transmission speed. Silicon optical bench technology for optical interconnect applications provides specific characteristics of miniaturized sizes, a good heat spreading, and so on. In addition, the fabrication process can be achieved by employing a standard semiconductor process technology. Therefore, it provides assembly with highly precise alignment, and mass-production possibilities. In this paper, a free-space optical interconnect technology, which can serve as a board on board and/or USB 3.0 applications, is realized by using a silicon-optical bench. The transceiver module on the silicon micro-optical bench includes of a monolithic 45∘micro-reflector, V-groove fiber array, high frequency transmission line for 2.5 GHz and bonding pads. The designed silicon optical bench is possessed of a 45∘micro-reflector with 110 ?m. And the process tolerance can be controlled within 6%. Through the ray-tracing simulation methods, the coupling efficiency of transceiver and receiver part reaches up to -6 dB and -2 dB, respectively.
