| 摘要: | 本研究成功利用無電鍍方式，於車用印刷電路板上鍍製一層Co(W,P)表面處理層，經表面分析與測試，本研究所鍍製之鍍層具良好品質與附著性，且可利用控制酸鹼值達到調整鍍層元素組成與改變表面形貌，並且在自製之腐蝕腔體中進行腐蝕測驗，並且比較無鍍層之裸銅、無電鍍鎳/浸金、浸錫表面處理之抗腐蝕能力與腐蝕現象，本研究之無電鍍鈷試片在二氧化硫為150 ppm濃度下具有較好之抗蝕能力，而當濃度調整至4000 ppm時所研究之試片皆於136小時後產生大量表面腐蝕，使鍍層表面長出腐蝕物外也造成表面破裂，並且有觀察到爬行腐蝕現象。本研究利用溫度濕度偏壓測試對試片進行溼氣壓力測試，在溫度85 oC、相對溼度85% RH且通以100伏特之偏壓，結果顯示無電鍍鈷鍍層具有較好之抗溼氣能力，故無電鍍鈷表面處理是可以成為應用在高可靠度車用印刷電路板之表面處理層。;In this study, the electroless plating Co (W, P) surface finish was successfully plated on printed circuit boards (PCBs). According to surface analysis and test, the electroless plating Co (W, P) in our work perform well quality and adhesion. Furthermore, the morphology and composition can be controlled by pH adjustment. The corrosion tests were treated in corrosion chamber with different surface finishes as following, electroless cobalt, copper, electroless nickel immersion gold (ENIG), immersion tin (ImSn). Compare with the corrosion resistive property with different surface finishes. In our study, substrate with Co (W, P) surface finish has better corrosion resistive under SO2 with 150 ppm. When the concentration of SO2 increased to 4000 ppm, large corrosion of all the samples were observed on the surface after 136 hours. The creep corrosion phenomenon, corrosion product, and crack were observed on the surface. In addition, the temperature humidity pressure test was also treated on those substrates with different surface finishes. At 85 oC and 85% relativity humidity, the Co (W, P) surface finish substrate shows great humidity resistive under 100 V. In summary, Co (W, P) surface finish has high potential to used on high reliability automobile printed circuit boards. |
