本研究提出以玻璃為中介層實現4通道 × 25 Gbit/s光連接收發模組，此模組被設定在高端伺服器內，應用於晶片與晶片或板對板之間的資料傳輸。本論文主要的研究方向為光連接之發射端光學次系統組裝模組，整合高分子聚合物波導、面射型雷射、微透鏡及射頻傳輸電路至玻璃中介層。 在玻璃中介層上製作微透鏡結構，用於聚集面射型雷射至高分子聚合物波導間的雷射光。在單模光纖代替面射型雷射之量測系統中，其結果最大耦光效率為49%；單端共面波導傳輸線，用於連接雷射驅動晶片及雷射，量測結果插入損耗為0.32 dB、反射損耗為30 dB；差動共面波導傳輸線，用於連接驅動雷射驅動晶片及印刷電路板，模擬結果插入損耗為1.52 dB、反射損耗為10 dB。 高分子聚合物波導及單端共面波導傳輸線的特性已從量測中證明符合系統需求，並且此組發射端光學次系統組裝模組將被應用在100 Gbps之光連接模組。差動共面波導傳輸線需考慮印刷電路板模組的設計及雷射驅動晶片的能力，再作進一步的調整以完成整個光連接發射端模組。 ;In this thesis, we proposed a 4-channel × 25-Gbps optical interconnect using glass interposer, which is designed for chip-to-chip connecting. The modules assemble VCSELs, glass interposer, micro-lens and polymer waveguides to realize a transmitter optical sub-assembly for high speed optical interconnect. The 1 4 micro-lens array on glass interposer is utilized to collect laser between VCSELs and polymer waveguides; the polymer waveguides combined with 45 degree reflector is used to connect the VCSELs and MMFs. The connections of VCSELs to VCSEL Drivers and VCSEL Drivers to PCBs are linked by RF transmission lines. The optical coupling efficiency of 49% from SMF to MMF via glass interposer and polymer waveguides is measured. The single-ended transmission lines used to link VCSELs to VCSEL Drivers have insertion loss of 0.32 dB and return loss of 30 dB; the differential transmission lines used to link VCSEL Drivers to PCBs have insertion loss of 1.52 dB and return loss of 10 dB. The optical and electrical characteristics of TOSA modules reach the demands of coupling efficiency, tolerance deviation and high frequency characteristic. It demonstrates that this TOSA module could be applied to a 100-Gbps optical interconnect.
